SK Hynix’s new chips 4 times fasterSK Hynix plans to commercialize a graphic DRAM chip that is four times faster than the previously fastest available, GDDR5, next year.
The world’s second-largest memory chipmaker said yesterday it has developed the high-bandwidth memory product, or HBM, working together with the Austin, Texas-based Advanced Micro Devices.
The new chip is the first to adopt a technology called “through-silicon via” to process 128 gigabytes of data per second, compared to the GDDR5’s 28 gigabytes per second, SK Hynix said. The HBM also runs on 40 percent less power than the GDDR5.
Like GDDR products, the HBM was developed mainly for graphics applications, not mobile devices, which use low-powered DDR chips.
However, HBM has the potential for wider usability and can be applicable for super computers, SK Hynix said.
HBM chips should be popularized by 2015, analysts said.
“We are commercializing the HBM products, utilizing the TSV technologies next year,” said Hong Sung-joo, the head of DRAM development unit at SK Hynix.
“Beginning with that, we will strengthen our product portfolio and continue to secure a leading position in the memory chip market.”
BY MOON GWANG-LIP [firstname.lastname@example.org]
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