Samsung Electro-Mechanics develops tiny new substrate for connected cars

Samsung Electro-Mechanics has developed an automotive semiconductor package substrate tailored to driving assistance systems, in a move that extends the usable range of chip products for cars.

2023-02-27

Korean chip packaging to be shown at KPCA 2022

Korean companies will show the newest semiconductor packaging technology at an annual trade show on Wednesday, as techniques grow more important in improving the performance of high-end chips.

2022-09-20

Samsung Electro-Mechanics bets big on its chip substrates

What Samsung Electro-Mechanics is eyeing in particular is a flip-chip ball grid array (FC-BGA) substrate, a sophisticated type of chip substrate designed to bind together high-performing processors used in computers and servers.

2022-07-18

Samsung Electro-Mechanics in talks with Tesla about cameras

Samsung Electro-Mechanics is in talks with Tesla to supply camera modules, according to the Korean electronics component maker on Thursday.

2022-06-09

Samsung Electro-Mechanics invests in capacity expansion

Samsung Electro-Mechanics invested 300 billion won ($247 million) to ramp up semiconductor package substrate capacity at its plant in Busan.

2022-03-21

Lee Jae-yong calls for Samsung to stabilize component supply

Samsung Electronics Vice Chairman Lee Jae-yong called for the need to stabilize the supply of electric components produced by Samsung Electro-Mechanics in the face of growing demand.

2020-07-16