Korea Joongang Daily
Korea JoongAng Daily

Samsung Electro-Mechanics to up sales ratio of premium chip package substrate to 50%

The Samsung affiliate said it would increase the rate of sales of its Flip Chip Ball Grid Array to 50 percent by 2026.

2024-08-25

Samsung Electro-Mechanics develops tiny new substrate for connected cars

Samsung Electro-Mechanics has developed an automotive semiconductor package substrate tailored to driving assistance systems, in a move that extends the usable range of chip products for cars.

2023-02-27

Korean chip packaging to be shown at KPCA 2022

Korean companies will show the newest semiconductor packaging technology at an annual trade show on Wednesday, as techniques grow more important in improving the performance of high-end chips.

2022-09-20

Samsung Electro-Mechanics invests in package substrates

Samsung Electro-Mechanics will invest 300 billion won ($231 million) to expand production of semiconductor package substrates and widen its product range to produce substrates for servers.

2022-06-22

Samsung Electro-Mechanics invests in capacity expansion

Samsung Electro-Mechanics invested 300 billion won ($247 million) to ramp up semiconductor package substrate capacity at its plant in Busan.

2022-03-21