Korean chip packaging to be shown at KPCA 2022

Tech

Published: 20 Sep. 2022, 18:18

Korean chip packaging to be shown at KPCA 2022

Rendering of a Samsung Electron-Mechanics booth at the KPCA Show 2022 [SAMSUNG ELECTRO-MECHANICS]

Korean companies will show the newest semiconductor packaging technology at an annual trade show on Wednesday, as techniques grow more important in improving the performance of high-end chips.

Samsung Electro-Mechanics introduced its first range of flip-chip ball grid array (FCBGA) packages for servers at the KPCA Show 2022 in Seoul. FCBGA refers to a sophisticated type of chip substrate designed to bind together high-performing processors and protect them from the surrounding environment.

It is its first FCBGA packages for servers. Its existing product line consists of package substrates for PCs and mobile devices.

The server packages are scheduled to be mass-produced by the end of this year.

The company, which is 23.7 percent owned by Samsung Electronics, has said its relatively late entry into the server market was due to the high technological barrier presented by the product range.

With sizes four times larger than packages used for PCs and mobile phones, server FCBGAs have denser layers than conventional packages.

Samsung Electro-Mechanics announced in March a 300-billion-won ($215-million) investment in manufacturing of FCBGA packages at its Busan plant. A separate investment of $850 million is planned for its Vietnamese plant to produce the same type of substrate.

LG Innotek is bringing its first FCBGA products to the trade show. The company, a camera module supplier for Apple’s iPhone series, has never produced FCBGAs before.

It will start mass production of them next year on new production lines.

It is investing 1.4 trillion won on the construction of chip packaging lines and camera module lines at its production site in Gumi, North Gyeongsang, the company announced in July.

BY PARK EUN-JEE [park.eunjee@joongang.co.kr]