Nepes makes chip package to get around PCB shortage
Its “nepes System in Package (nSiP)” is an integrated circuit packaging using redistribution layers as well as an extra metal layer on a chip as an alternative to PCB substrates.
The packaging technique reduces the overall size of integrated circuits by 30 percent and the thickness by around 60 percent, according to the company.
Nepes is promoting its new system at the Electronic Components and Technology Conference (ECTC), which is being held virtually from June 1 through July 4.
The company recently released samples to customers around the world.
Nepes is addressing the global shortage of PCB substrates.
“The nSiP could meet growing demand for high-performing chips and components by providing a new solution,” said Kim Tae-hoon, President of Corporate Marketing at Nepes.
“It will also help relieve the chronic shortage of substrate which is disrupting overall supply chain management,” he said.
BY PARK EUN-JEE [email@example.com]