Samsung Electronics Vice Chairman meets with Intel CEO

Samsung Electronics Vice Chairman Lee Jae-yong, right, shakes hands with President Yoon Suk-yeol during an event on May 25 at the presidential office in Yongsan, central Seoul. [JOINT PRESS CORPS.]

Samsung Electronics Vice Chairman Lee Jae-yong met with Intel CEO Pat Gelsinger in Seoul on Monday to discuss next generation chip development and chipmaking.

“Vice Chairman Lee and Gelsinger had a number of meetings to share views on the collaboration in different areas, such as next-generation memory chips, system-on-chips, foundry, PC and mobile,” Samsung Electronics said in a statement.

Kyung Kye-hyun, CEO of the Device Solutions division, Roh Tae-moon, president of the Mobile eXperience (MX) division, and Lee Jung-bae, president of the memory business, also attended. The Device Solutions division runs the memory, foundry and system-on-chip businesses.

Other executives attending the meeting include Choi Si-young, president of the foundry business, and Park Yong-in, president at the System LSI business, which designs system-on-chips and image sensors.

Local media outlets said the Intel CEO stopped by Seoul on his way back to the United States from the World Economic Forum in Switzerland.

The two companies are closely connected since Samsung Electronics develops the Double Data Rate 5 and other advanced memory chips, which must be compatible with Intel's central processing units (CPU).

Intel is the world's top producer of CPUs used in PCs.

Intel wants to use more third-party chipmakers to manufacture advanced processors designed by the Santa Clara, California,-based company.

“Gelsinger said he expects Intel’s engagement with third-party foundries to grow and to include manufacturing for a range of modular tiles on advanced process technologies, including products at the core of Intel’s computing offerings for both client and data center segments beginning in 2023,” Intel said in a statement last year.

BY PARK EUN-JEE [park.eunjee@joongang.co.kr]