Merck targets commercialization of next-gen chip technology amid AI boom

Industry

Published: 02 Feb. 2024, 15:41

Merck targets commercialization of next-gen chip technology amid AI boom

Second from right, Merck's Chief Commercial Officer and Executive Vice President Anand Nambiar speaks at a press event on Friday after keynote speeches given by Merck executives at Shilla Stay Samsung in southern Seoul. [MERCK KOREA]

Merck, a German chemical and technology giant, plans to commercialize next-generation chip manufacturing technology dubbed “Directed Self-Assembly” in the "next couple of years."

Directed Self-Assembly (DSA) is a technology that uses chemical processes to create precise chip patterns at smaller scales. The technology could simplify the production process to pattern silicon wafers used in chips, said Merck.

Merck believes that the AI boom has further triggered acceleration into the semiconductor market as high-performance chips are crucial in creating more advanced generative AIs. The global AI chip market is expected to grow to $400 billion business by 2027 from the current $50 billion — and possibly grow to the scale of $1 trillion in the next seven to 10 years, according to Merck data.

Merck’s involvement in the electronics sector revolves around supplying materials in semiconductor manufacturing. Merck’s current key focus is integrating DSA technology with extreme ultraviolet (EUV) lithography.

When the technology is applied to EUV lithography, an advanced chip manufacturing technique used to create intricate patterns on a silicon wafer, the production process could be simplified and importantly, bring down costs, according to Merck.

“You’ve heard about how expensive the EUV process is and how expensive the equipment is,” said Merck’s Chief Commercial Officer and Executive Vice President Anand Nambiar at a press event in southern Seoul. “We believe that DSA brings down the cost of ownership in EUV equipment. We also believe that the EUV technology also has limitations and DSA will be a needed, complementary technology to shrink patterns even further from where we are today.”

Nambiar said that utilizing DSA technology could “remove two EUV steps — which is significant” and aims to have the technology commercialized over the next couple of years.

Nambiar said that the company is engaged in collaborative research and development on this new technology with global chip leaders, including those from Korea, although he did not specify the names of the companies involved.

BY LEE JAE-LIM [lee.jaelim@joongang.co.kr]