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The National Assembly must hurry in approving the bills related to chip promotion, AI and electricity infrastructure to vitalize the chip habitat.
Korea's chip packaging market share has declined significantly, hindering its competitiveness in advanced semiconductor manufacturing crucial for AI.
SK hynix focused on advanced packaging tech for high-demand HBM, aiming to meet AI market needs.
SKC, the material and chemical unit of SK Group, said Monday it acquired 12 percent of Austin, Texas-based chip packaging firm Chipletz amid growing demand for packaging technology.
The industry ministry said Tuesday it signed a memorandum of understanding (MOU) with Samsung Electronics, SK hynix and other chip firms to cooperate on technology development for advanced semiconductor packaging.
Those little rectangular juice boxes that seem to be everywhere have a name.
Nepes, which makes semiconductor packages, has developed a new technology that does away with printed circuit boards (PCBs), which are currently in short supply around the world.
A Korea Post employee lifts up a packaged box with two holes to help delivery workers lift boxes on Monday at the institution's headquarters in Jung District, central Seoul.
Samsung Electronics has test-produced a chip using an advanced three-dimensional design to enhance chip performance and device packing density, the company announced Thursday.
Korea JoongAng Daily Sitemap