SK hynix starts mass production of 238-layer NAND

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SK hynix starts mass production of 238-layer NAND

SK hynix's 238-layer NAND flash memory chip [SK HYNIX]

SK hynix's 238-layer NAND flash memory chip [SK HYNIX]

SK hynix has started mass production of 238-layer NAND flash memory chips, marking the commercialization of the world's highest-layer NAND.

 
The chipmaker is currently testing the chip's compatibility with smartphone makers. The chip’s application will extend from smartphones to solid-state drives for PCs as well as data centers, the chipmaker said.  

 
“Along with the existing 176-layer chip, the 238-layer one has secured top-class competitiveness in cost, performance and quality,” the company said.  
 
“These products will play a role in boosting company earnings in the latter half.”
 
The 238-layer chip, according to SK hynix, can transfer data at a speed of 2.4 gigabytes per second, which is 50 percent faster than the previous version with 176 layers. Its productivity also improved by 34 percent.
 
“We will continue to overcome NAND technology limitations and increase our competitiveness so that we can achieve a bigger turnaround than anyone else during the upcoming market rebound,” said Kim Jum-soo, head of S238 NAND, at the company in a release Thursday.  
 
How many layers of memory cells a company can stack is crucial in determining the quality of a NAND flash memory chip as more layers mean more storage capacity and price competitiveness.
 
Such technology came about when placing cells horizontally hit limits in increasing capacity.  
 
Samsung Electronics is currently mass-producing a 236-layer memory chip and Micron 232-layer memory chip.  
 
 
 
 

BY JIN EUN-SOO [jin.eunsoo@joongang.co.kr]
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