Samsung's Lee Jae-yong visits future semiconductor complex

Samsung Electronics Executive Chairman Lee Jae-yong, far left, inspects the construction site of the company's semiconductor R&D complex being built in Giheung, Gyeonggi, on Thursday. [SAMSUNG ELECTRONICS]

Samsung Electronics Executive Chairman Lee Jae-yong visited the company's semiconductor complex currently under construction in Giheung, Gyeonggi Thursday and held meetings with executives in an effort to shore up its stagnant chip business.

The chip complex in Giheung broke ground last year and Samsung Electronics pledged to invest 20 trillion won in the facility by 2028. The complex is expected to cover a 109,000-square-meter (1,170,000-square-feet) land site within Samsung's existing Giheung campus. The new facility will be in charge of research and development (R&D) on advanced chip technology.

The complex will also encompass manufacturing and retail infrastructure.

On Thursday, Lee was briefed on the status of Samsung's next-generation chip technology development. He then went over how to raise competitiveness of Samsung's processors, memory chips and contract chip manufacturing businesses.

The meeting was attended by Kyung Kye-hyun, head of Samsung's semiconductor division, Lee Jung-bae, head of Samsung's memory chip business, Choi Si-young, head of contract chip manufacturing business and Song Jai-hyuk, chief technology officer, at Samsung's semiconductor division.

Lee has been keen on elevating the competitiveness of Samsung's chip business by investing in R&D.

In March, the executive chairman said he will expand the firm's chip R&D centers twofold in terms of both quality and quantity.

“It is a difficult situation but there should not be the slightest turbulence in fostering talents and investing in future technology,” Lee said when he visited Samsung's Cheonan campus in February.

BY JIN EUN-SOO [jin.eunsoo@joongang.co.kr]